Arm Unveils 2024 CPU Core Designs, Cortex X925, A725 and A520: Arm v9.2 Redefined For 3nm
by Gavin Bonshor on May 29, 2024 11:00 AM EST- Posted in
- CPUs
- Arm
- Smartphones
- Mobile
- SoCs
- Cortex
- 3nm
- Armv9.2
- Cortex-A520
- Cortex X925
- Cortex A725
Arm Cortex X925: Leading The Way in Single-Threaded IPC
The Arm Cortex-X925, codenamed "Black Hawk," as Arm boldly claims, stands at the forefront of single-threaded instruction per clock (IPC) performance, setting things up for improved performance and efficiency in a big way, at least from Arm's claims. This core is a pivotal part of Arm's move to the 3 nm process node and integrates seamlessly into the second-generation Armv9.2 architecture. If Arms claims were taken as gospel, the Cortex X925 would be positioned as a leader in high-performance mobile computing and is an example of where Arm and its focus on a highly efficient PPA is the driving force with Arm's 2024 CPU Core Cluster.
The Cortex-X925 is built on architectural improvements designed to maximize IPC. One of the standout features is its 10-wide decode and dispatch width, significantly increasing the number of instructions processed per cycle. This enhancement allows the core to execute more instructions simultaneously, leading to better utilization of execution units and higher overall throughput.
Arm has doubled the instruction window size to support this wide instruction path, allowing more instructions to be held in flight at any given time. This reduces stalls and improves the efficiency of the execution pipeline. Additionally, the core boasts a 2X increase in L1 instruction cache (I$) bandwidth and a similar increase in L1 instruction translation lookaside buffer (TLB) size. These enhancements ensure that the core can quickly fetch and decode instructions, minimizing delays and maximizing performance.
The Cortex-X925 also features a highly advanced branch prediction unit, which reduces the number of mispredicted branches. By incorporating techniques such as folded-out unconditional direct branches, Arm has removed several architectural roadblocks, enabling a more streamlined and efficient execution path. This leads to fewer pipeline flushes and higher sustained IPC.
The front end of the Arm Cortex-X925 showcases plenty of improvements within the design, including boosting instruction throughput and reducing latency. Central to these improvements is the 10-wide decode and dispatch width, which allows the core to handle more instructions per cycle compared to previous architectures. This wide instruction path increases the parallelism in instruction processing, enabling the core to execute more tasks simultaneously.
Additionally, the Cortex-X925 features a doubled instruction window size, accommodating more instructions in flight and minimizing pipeline stalls. The L1 instruction cache (I$) bandwidth has also been increased by 2x, along with a similar expansion in the L1 instruction translation lookaside buffer (iTLB) size. These enhancements ensure that the core can quickly fetch and decode instructions, significantly reducing fetch bottlenecks and improving overall performance.
The backend of the Cortex-X925 has seen significant growth in out-of-order (OoO) execution capabilities, with a 25-40% increase. This growth allows the core to execute instructions more flexibly and efficiently, reducing idle times and improving overall performance. Furthermore, the core's register file structure has been enhanced, increasing the reorder buffer size and instruction issue queues, contributing to ultimately smoother and, thus, faster instruction execution.
Despite its high performance, the Cortex-X925 is designed to be power efficient. The 3 nm process technology is crucial, enabling better power efficiency than previous generations. The core's design includes features such as dynamic voltage and frequency scaling (DVFS), which allows it to adjust power and performance levels based on the workload. This ensures energy is used efficiently, extending battery life and reducing thermal output.
The Cortex-X925 also incorporates advanced power management features, such as per-core DVFS and improved voltage regulation. These features help manage power consumption more effectively, ensuring the core delivers high performance without compromising energy efficiency. This balance is particularly beneficial for mobile devices requiring sustained performance and long battery life.
The Cortex-X925 is also designed for and optimized for AI-based workloads, with dedicated AI accelerators and software optimizations that enhance AI processing efficiency. With up to 80 TOPS (trillion operations per second), the core can handle complex AI tasks, from natural language processing to computer vision. These capabilities are further supported by Arm's Kleidi AI and Kleidi CV libraries, which provide developers with the tools needed to build advanced AI applications.
Interestingly, Arm hasn't moved into the realm of NPU or AI accelerators itself. Instead, it allows its partners, such as MediaTek, to incorporate their own, ensuring that the Core Cluster can provide the necessary support and integration capabilities. With its reference software stack and optimized libraries, the CSS platform provides a robust foundation for developers. The inclusive Arm Performance Studio offers advanced tooling environments that help developers optimize their applications for the new architecture.
The CSS platform's integration with operating systems such as Android, Linux variants, and Windows through its reinvigorated Windows on Arm OS ensures broad compatibility and ease of development. This cross-operating system support enables developers to quickly and efficiently build applications that leverage the capabilities of the Cortex-X925, along with the entirety of the updated Armv9.2 Core Cluster, which not only accelerates time-to-market but ensures compatibility across multiple devices.
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SarahKerrigan - Wednesday, May 29, 2024 - link
"The core is built on Arm's latest 3 nm process technology, which enables it to achieve significant power savings compared to previous generations."ARM doesn't have lithography capabilities and this is a synthesizable core. This sentence doesn't mean anything.
meacupla - Wednesday, May 29, 2024 - link
AFAIK, the core design needs to be adapted to the smaller process node, and it's not as simple as shrinking an existing design.Ryan Smith - Wednesday, May 29, 2024 - link
Thanks. Reworded.dotjaz - Wednesday, May 29, 2024 - link
"ARM doesn't have lithography capabilities and this is a synthesizable core"And? Apple also doesn't have litho. You are telling me they can't implement anything with external foundries? Do you even know the basics of modern chip design? DTCO has been THE key to archieve better results for at least half a decade now.
Also this is clearly not just a synthesizable core. ARM explicitly announced this is avaiable as production ready cores, that means the implementations are tied to TSMC N3E and Samsung SF3 via DTCO, and this is the first time ARM has launched with ready for production hard core implementation.
You clearly didn't understand, and that's why it didn't mean anything TO YOU, and probably had to be dumbed down for you.
It actually makes perfect sense to me.
lmcd - Wednesday, May 29, 2024 - link
There was a turnaround time slide that didn't get Anandtech text to go with it that made this more clear, but a skim would miss it.zamroni - Monday, June 17, 2024 - link
it means the logic circuit is designed for 3nm's characteristics, e.g. signal latency, transistor density etc.older cortex designs can be manufactured using 3nm but it won't reach same performance as they were designed to cater higher signal latency of 4nm or older generations
Duncan Macdonald - Wednesday, May 29, 2024 - link
Lots of buzzwords but low on technical content. Much of this reads like a presentation designed to bamboozle senior management.Ryan Smith - Wednesday, May 29, 2024 - link
Similar sentiments were shared at the briefing.continuum - Thursday, May 30, 2024 - link
Whole tone of this article feels like it was written by an AI given how often (compared to what I'm used to in previous articles on this from Anandtech!) certain sentiments like "3nm process" and other buzzwords are used!name99 - Wednesday, May 29, 2024 - link
Not completely true...Interesting points (relative to Apple, I don't know enough about Nuvia internals to comment) include
- 4-wide load (vs Apple 3-wide load) is a nice tweak.
- 6-wide NEON is a big jump. Of course they have to scramble to cover that they STILL don't have SVE or SME; even so there is definitely some code that will like this, and the responses will be interesting. I can see a trajectory for how Apple improves SME and SSVE as a response, probably (we shall see...) also boosting NEON to 256b-SVE2. (But for this first round, still 4xNEON=2xSVE2)
Nuvia, less clear how they will counter.
Regardless I'm happy about both of these and requiring a response from Apple which, in turn, makes M a better chip for math/science/engineering (which is what I care about).
They're still relying on run-ahead for some fraction of their I-Prefetch. This SOUNDS good, but honestly, that's a superficial first response and you need to think deeper. Problem is that as far as prefetch goes, branches are of two forms – near branches (mostly if/else), which don't matter, a simple next line prefetcher covers them; and far branches (mostly call/return). You want to drive your prefetcher based on call/return patterns, not trying to run the if/else fetches enough cycles ahead of Decode. Apple gets this right with an I-prefetcher scheme that's based on call/return patterns (and has recently been boosted to use some TAGE-like ideas).
Ultimately it looks to me like they are boxed in by the fact that they need to look good on phones that are too cheap for a real NPU or a decent GPU. Which means they're blowing most of their extra budget on throughput functionality to handle CPU-based AI.
Probably not the optimal way to spend transistors as opposed to Apple or QC. BUT
with the great side-effect that it makes their core a lot nicer for STEM code! Maybe not what marketing wanted to push, but as I said, I'll take it as steering Apple and QC in the right direction.
I suspect this is part of why the announcement comes across as so light compared to the past few years – there simply isn't much new cool interesting stuff there, just a workmanlike (and probably appropriate) use of extra transistors to buy more throughput.