At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the form of N5P and N4 process nodes. Starting off with TSMC’s upcoming N5 process node which represents its 2nd generation deep-ultraviolet (DUV) and extreme-ultraviolet (EUV) process node after the rarely used N7+ node (Used by the Kirin 990 SoC for example). TSMC has been in mass production for several months now as we’re expecting silicon shipping to customers at this moment with consumer products shipping this year – Apple’s next-generation SoCs being the likely first candidates for the node. TSMC details that N5 currently is progressing with defect densities one quarter ahead of N7, with the new...
Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...18 by Anton Shilov on 10/18/2019
TSMC has quietly introduced a performance-enhanced version of its 7 nm DUV (N7) and 5 nm EUV (N5) manufacturing process. The company’s N7P and N5P technologies are designed for...36 by Anton Shilov on 7/30/2019